SAM thru non-electro metal plating gives a very thin seed layer on the entire surface of master mold with high precision structure
and high aspect ratio. This enables LEAP to produce a metal mold with high precision structure and high aspect ratio.

• 

  Alumina Holes
  Hole φ: About 70 nm

• 

  Ni Mold replicated from
  Alumina Holes (master)
  Pillar φ : 93 - 100 nm

• 

  Ni Mold replicated from
  Alumina Holes (master)
  Pillar φ : 100 nm
  Pillar hight : more than 728nm

• - SAM technology for metal mold production co-developed with WASEDA University
• - Patent pending

Future Application Fields
Optical Elements, BIO Technology, LED, Solar Cell, Semi-Conductors, MEMS, Engineering Materials etc.